DATACON PPS 2200 Wafer-binding machine

Type: PPS 2200
Producer: DATACON
Created: 1997
parameters:
Coloring:
Lower cover: dark gray powder 56.900 70 M
Upper panel: light gray powder 56.900 60 m
Upper frame: ultramarine blue RAL 5002
Control surface: water blue RAL 5021
Control: VME bus / CAN bus
Operator - Monitor / Operator - Interface:
15 "Flat Screen Monitor / Windows - similar
Operating system: Vx - Works
Network card (CONV-500):
Plug for network connection:
10BaseT 10Base2 and AUI
Data storage:
Internal - Hard disk
External - 3.5 "drive (only HD disks with 1.44 MB)
Chip sizes 0.2 - 20 mm
(Manual adjustment of ejection system ejection kits required)
Chip thicknesses> 0.15 mm
Wafer sizes: up to 203 mm (8 ")
Frame sizes: up to 276 mm (11 ")
substrate:
Substrate size (transport system)
Max. 255x203x30 mm
Component height (eg SMD's)
Max. 30 mm. with tool changer up to 10 mm
Substrate transport height (SMEMA 1.2) 940 - 945 mm or 37 - 38 "
Max. Number of bond points / individual benefits 100 per chip type
Max. Number of individual uses / substrate 100 with free programming
60,000 in matrix programming
Max. Number of individual substrates / transport unit
(Carrier or boat) 300
Tool changer:
Max. Number of tool holders 6
Tool change time approx. 1.5 sec.
Ausstechsystemwechsler:
Max. Number of change tools 5
Tool change time ca:
4 sec. When changing from the 1st to the 4th tool
(This time is integrated in the wafer change time and is therefore not decisive)
Epoxy module:
Work area (XYZ) 254x200x50mm
dispenser:
Feed method (standard) Metering via feed spindle
Feed Method (Optional) Pressure / Time - Dose
Cartridge sizes:
5. 10. and 30 ccm (on the additional Z-axis only up to 10 ccm)
Pick & Place module:
Working area (XYZ) 254x200x30 mm
Working area with additional Z-axis 200x200x30 mm
Machine dimensions: 800x1200x2000 mm
Machine weight: 700 kg
Documentation / MANUAL is in German.